PCBA · Ramp to volume
First-pass yield erodes as boards move from pilot to volume.
“Our yield keeps dropping.”
Our solution
We separate process, design and test causes. Failures are sorted by station and defect code, reflow profiles are checked against the paste specification, and X-ray is used where optical inspection is blind (BGA voiding, head-in-pillow). We then check test limits and gauge R&R, so real defects are not hidden among false fails.